Cushioning Shock Tester

Product Details:

Dynamic characteristic test of cushioning materials can be tested. Also, in a test repeated an automatic operation, reduction in cushioning effect and loss in thickness which result from impact applied repeatedly can be measured.

Product Details:

• The impact rate change characteristics of the dimensions load-change characteristics and consistent dimensions load is simply acquired.
• The buffering characteristic is simply acquired using buffering characteristic analysis software.
• A control device can perform operation altogether except setting of the weight and the fall height of the fall weight and the size of a specimen.
• The rebound stop equipment of the fall weight is equipped.

Feature

• The impact rate change characteristics of the dimensions load-change characteristics and consistent dimensions load is simply acquired.
• The buffering characteristic is simply acquired using buffering characteristic analysis software.
• A control device can perform operation altogether except setting of the weight and the fall height of the fall weight and the size of a specimen.
• The rebound stop equipment of the fall weight is equipped.

Applications:

• Testing of cushioning materials (cardboard boxes, expanded polystyrene, urethane foam and etc).

Product Details:

ow more reliable than ever, the TSA series provides network connectivity:

• TSA series is ESPEC's best-selling damper-type thermal shock chamber. By new instrumentation featuring significantly increased in processing speed and network connectivity, it is now possible to monitor and manage the status of chambers from remote locations even sitting at your desk. 

Highly accurate temperature recovery:

• Dampers with integrated rectifying function minimize variation in exposure conditions due to specimen position within the test area. 

The newly developed refrigeration system:

• Maximum 50% reduction in power consumption with Eco operation mode and new refrigerator control system 

Network solutions:

• Control and monitor your chamber on-site or remotely,edit and transfer programs from one chamber to another,and receive email alerts even on your mobile.

Product Details:

Significant reductions in fluid usage make liquid thermal shock affordable, The "liquid to liquid" thermal shock testing draw more and more attention for its ability to impose higher stress on specimens than the classic "air to air" thermal shock tests, but also for delivering quicker test results. ESPEC developed next-generation equipment satisfying environment conservation by lowering running costs, especially regarding brine and power consumption.

Product Details:

Innovative hybrid test system that provides thermal cycle testing and dew cycle testing in a single unit:

• Mobile devices, such as laptops and cell phones, and automotive electronic parts are subjected to rapid temperature changes as they move between outside and inside environments. 
• Naturally, these products and parts require thermal cycle testing, which repeatedly subjects them to rapid warming and cooling. Dew condensation that forms as a result of temperature changes also poses a major problem. 
• Dew condensation can greatly affect the performance and function of electronic devices and result in corrosion, migration, or malfunction. Therefore, dew cycle testing, which repeatedly re-creates dew condensation and dry conditions is essential. 
• "Air to Air Thermal Shock Chamber with Humidity" is an innovative hybrid test system that enables both tests in a single unit. Two tests that have conventionally required two separate test chambers can now be performed in one unit, thereby lowering costs and space requirements.

Innovative hybrid test system:

• The hot chamber at the top of the thermal shock chamber (TSA) has been changed to a high temperature and humidity chamber that can control humidity, thereby enabling dew cycle tests. 
• The ability to perform two tests in one unit not only lowers costs and space requirements, but it also saves on labor required to insert and remove specimens, thereby reducing testing manpower.

Features humidity cycle test functions:

• Excellent temperature uniformity generates uniform dew condensation on the specimen.
• Controlling the temperature of the test area walls prevents water droplets falling from the ceiling.
• A wind velocity controller in the high temperature and humidity chamber enables to control dew condensation time and uniformity.
• The high temperature and humidity chamber is equipped with a defrost circuit. There is no need to cancel a test to defrost.

Product Details:

A lineup of large-capacity Liquid to Liquid Thermal Shock Chambers:

• Three large-capacity chambers have been added to the TSB series of Liquid to Liquid Thermal Shock Chambers. 
• Compared to the air to air thermal shock type, the liquid to liquid thermal shock type applies higher stress on the specimen, and shortens a test time. 
• In addition, the load capacity has been increased in accordance with the larger specimen basket, thereby enabling support of large specimens.

Large-capacity test area:

• It is available from three test area capacities: approximately 10 liters, 15 liters, and 30 liters.

Various mechanisms to greatly reduce consumption of brine:

• To reduce brine consumption, the airtightness of the test area has been increased to prevent vapor leaks and evaporation has been prevented.There are also other mechanisms to recycle brine after separating water by the filter for.

Smooth specimen transfer:

• An air cylinder reduces vibration to the specimen. A new drivel mechanism, when inserting the specimen into the water bath, is being used to control excess stress to the specimen during transferred between the hot chamber and cold chamber.

TSB series common operability:

• Basic control method is common by using the same interactive touch panel instrumentation as that of the standard Liquid to Liquid Thermal Shock Chamber.

Product Details:

High-temperature exposure 300°C control supporting specimens with high heat resistance, The power semiconductors required for power conversion circuits in the power supply control of home appliances and motor control of hybrid vehicles for high efficiency use of electrical energy are changing from silicon to silicon carbide (SiC). Silicon carbide, with its low power loss, pressure resistance, and high thermal conductivity, is being heralded as the next-generation power semiconductor. These next-generation power semiconductors are required to be heat resistant to high-temperature stress resulting from high-capacity current and therefore, ESPEC offers thermal shock chambers with temperature control up to 300°C.

Features:

• Perform two-zone and three-zone tests without auxiliary cooling.
• Fixed test chamber design provides easy cable wiring for test measurements and voltage application. (TSA series)
• Equipped with an automatic safety door lock function that automatically locks the door and prevents opening when the internal chamber temperature is +190°C or higher.
• Eco operation can be performed during thermal shock testing from -70 to +200°C, thereby reducing power consumption by up to 35%. 
• Power consumption can be further economized during tests with multiple cycles and long exposure time.

Product Details:

Quick evaluation of solder crack:

• As product reliability demands and testing time for stress tests are increasing, product development time is decreasing. 
• This model combines the newly developed highly accelerated air to air thermal shock chamber, which has reduced thermal shock testing time by one-third, with a conductor resistance evaluation system, which evaluates the reliability of connectors on print substrates and electronic parts. 
• As a result, development time can be reduced and power consumption can be economized.

Features:

• Obtain test results that correlate with a conventional thermal shock test.
• High velocity and unique air flow control enable a temperature recovery time
• It reduces thermal shock testing time by one-third for significantly faster testing.
• Frost-free circuit prevents the formation of frost, thereby eliminating the need to stop a test and perform defrosting. 
• It reduces the time and power consumption used for defrosting.
• With wind velocity controller allows control of wind velocity, a chamber enables conventional thermal shock testing.
• Constantly measure micro current and micro resistance during thermal shock tests to accurately obtain the absolute value and rate of change to determine failures.
• Available from a direct current measurement system and an alternating current measurement system.